TEL: 13968141913/
13606798873(张总)
E-Mail:wzx@suhv.com
ADD:No.3,Sanhe Rd., Puiiang Economic Development Zone, Zhejiang Province China
In 2024, the domestic packaging material production capacity will be about 290,000 tons and the domestic consumption will be about 260,000 tons. At present, with the acceleration of the upgrade of electronic products, the requirements for packaging materials for semiconductor electronic components are getting higher and higher, and the demand is getting greater and greater.
The conductive masterbatch series products are mainly used for PS, ABS extrusion, injection molding and particle integral molding; goal: to replace Taiwan Junchi's domestic market share
Suitable for vacuum blister molding various pallets (place various electronic components), protecting electronic components from vibration damage and contamination in factory transportation, as well as packaging products that prevent static damage
Used in conjunction with carrier tape to protect carrier tape from damage during transportation